Contact Information

Company name:
Dynamic & Proto Circuits Inc.

Address:
869 Barton Street
Stoney Creek, Ontario, Canada L8E 5G6

Telephone:
866-643-9900
905-643-9900

Main Fax: 905-643-9911

Customer Service Fax: 905-643-9437

Need a quote: dynamic@dapc.com

Key Personnel
General Manager: Carl Hewitt
Manufacturing Manager: Balwant (Joe) Jowlabar
Engineering Manager: Brock Hunter
Quality Manager: Robin Burrough
Customer Service Supervisor: Cindy Sebrosky
Sales Manager: Ken Moffat
Quebec Regional Sales Manager: Tony Monaco
Western Canada Sales Manager: Ferd Schneidersmann
Northeast Regional Sales Manager: Charles Cobb

Subsidiaries: None

Type of business: Corporation

Date founded: 1974

List the individual most able to provide additional information on the Company's financial resources: Carl Hewitt, General Manager.

Company personnel: 130 total
Production staff: 65
Q.A. / Q.C.: 30
Production control: 3
Sales: 6
Engineering: 11
Administration: 15

Number of full shifts: 3

Vacation or shutdown schedule: None (staggered throughout the year).

Total plant size: 54,000 square feet. (5000m2)
Manufacturing: 31,100 sq.ft.(2880m2)
Engineering: 500 sq.ft.(50m2)
Stockroom: 2,000 sq.ft.(190m2)
Offices: 8,000 sq.ft.(750m2)
Waste treatment: 3,000 sq.ft.(275m2)
Other: 9,400 sq.ft.(875m2)

Total annual capacity (expressed in dollar value): US $30 million

Estimated percentage of total dollar volume:
Multilayers: 92%
Single/Double-sided: 2%
Others: 6%

What are the standard panel sizes kept in stock:
12" x 14" (305x356mm)
12" x 18" (305x457mm)
12" x 24" (305x610mm)
16" x 18" (406x457mm)
16" x 26" (406x660mm)
18" x 24" (457x610mm)
21" x 24" (533x610mm)

What do you consider, in number of Panels 18x24(460x610mm), to define the following:
High production: 500
Medium production: 250
Low production: 100
Quick Turn: 25
Prototype: 10 approx.

What is the average lead time (delivery) on the above:
High: 6 weeks
Medium: 5 weeks
Low: 4 weeks
Quick Turn: 7 days
Prototype: 2-5 days

Do you have a defined and published Quality Assurance Program: YES

Do you have a system to control material flow to satisfy purchasing lead time: YES

Do you have a system to inform customers of the status of orders: YES

Do you have Bar Coding order tracking in place: YES. We have data collection terminals throughout the plant from Engineering through to Shipping.

Is your company union? No, DAPC is non-union.

Do you have employee training and retraining programs: YES

List the certificates or approvals your company holds: ISO 9001-2000, UL, MIL-PRF-55110, MIL-PRF-31032

What is the numerical definition of the following tolerances in thousandths of an inch (mm), and what do you normally work to:

	Tight		Standard
Plated Holes	±0.001(.05mm)		±0.003(.080mm)
Lines	±0.0005(.013mm)		±0.001(.03mm)
Spacing	±0.001(.03mm)		±0.002(.05mm)
Angles	± 0.5°		±1.0°

Can you build controlled & differential impedance boards: YES

Explain the parameters and tolerances, also do you have your own TDR meter: Standard tolerance is ± 10%. We use a Polar CITS 500s to verify impedance readings.

What is the maximum layer count you have produced in a multilayer PWB: 36 layers.

What is the tightest SMT pitch you can produce: 0.016"(0.15mm)

Can you build buried or blind via product: YES

What do you consider to be the finest line width that you can produce with consistency (in thousandths of an inch):
Outer layers: 0.002"(0.05mm)
Inner layers: 0.002"(0.05mm)

What do you consider to be the smallest hole size that you can consistently plate through on 0.062¨(1.6mm) thick material: 0.006"(0.015mm)

What is the highest aspect ratio PWB you can build: 20:1

What do you consider to be the largest size hole that can be drilled and plated through in an 0.055¨(1.57mm) diameter land and still maintain a 0.005¨(0.127mm) min. annular ring in thousandths of an inch (mm):
Outer layers: 0.035"(0.89mm)
Inner layers: 0.035"(0.89mm)

What is the maximum panel size, which can travel through all processes in your plant:
Double-sided: 21" x 26"(533x660mm)
Multilayer: 21" x 24"(533x610mm)

When your customers supply artwork, which do you prefer: Electronic data (via email or FTP, CD, DVD)

Do you have computer generated artwork and modification capabilities: YES, 11 systems, Frontline Genesis Networked CAM seats

On production films, do you use:
tooling pins to align images: YES
1 CA Picard Film Punch
2 Multiline Post Etch Punch Registration
eye alignment: YES

List the laminate material types, which you use: FR4, Polyimide, Teflon, BT, Duroid, Getek, Cyanate-Ester, Nelco 13 material, Arlon, Rogers, High Temp FR4, RoHS complaint FR4, Isola

List the laminate material supplier which you most commonly use:

BRAND NAME		TYPE		Glass-Transition Temperature
Nelco		Standard FR-4		140ºC
Nelco/Isola/Panasonic		RoHS High Temperature		180ºC
		BT/Epoxy		180ºC
		Polyimide		265ºC
Rogers/Taconic/Arlon		Teflon		N/A

Is the laminate purchased to the new standard IPC-4101: YES

Are inner layers baked before lamination: YES

Are inner layers inspected and electrically tested before lamination: 100% Inspection, A.O.I. and/or Electrically if specified.

How are inner layers treated: Oxide Replacement.

Multilayer Prepreg - Explain the control of maximum time of storage, testing, environment and condition before use: Coded FIFO. 70 F(21.1 C) Max., 30-50 % RH

Multilayer Lay-up and Registration - Press brand name, details and model number: TMP vacuum-assisted hydraulic. 30" x 24"(762x610mm) 5 openings, 26" x 20"(660x508mm) 4 openings, Cedal, 1 Opening (50 panels typical)

Comment on method of ensuring elimination of delamination problems: Tight control of prepreg use and storage, tight control of oxide replacement and Vacuum Assisted laminating cycles.

What equipment do you use to put tooling holes into inner layers in order to ensure accurate layer-to-layer registration:
2 Multiline Post Etch Registration punches.
1 X-Ray Pluritec Inspecta

Type of drilling equipment:

1	Schmoll Drilling Machine	MX1-24 CCD
1	I.T.C.	Plane Razing Device
1	Pluritec	Simpla Pinning Machine
1	Barnaby	Automatic Pin Stacker
1	Pluritec	Minima Flash Router
1	Glenbrook Technologies	RT113 X-Ray Machine
1	Barnaby	Beveller
1	P.P.P.	Edge/Contact Beveller
2	PluriteC	Networked Program Planning Stations
2	Fastechnologies	Program Editor/Routliner & Novel File Serving Drill Network
1	Excellon	OPIC-IIIB Programmer with Plotter
1	Accu-score Labs	AS150 J Double Sided Jump Scoring Machine
1	Excellon	XL-3 CNC 2 Driller & Router - 4 Spindles
1	Excellon	Mark V CNC 6 Driller - 5 Spindles
1	Pluritec	Contour 300 Automatic 3 Head Routing Machine
1	Pluritec	Inspecta XR, X-Ray Multilayer Registration Optimizing Machine
12	Pluritec	Multistation Type V-3 Independent Spindle Automatic Drill
2	Pluritec	Giga Series 8000, 8 Spindle Drilling Machine

Total Number of drill heads: 32
Total Number of router heads: 9
Total Number of Driller/Router heads: 2

Is the drill tape programmed on the drill: NO
What equipment is used for drill tape programming: CAM systems and/or Excellon OPIC 3
Automatic drill change capability: YES
Controlled depth / Peck drilling capability: YES
How are hole sizes verified: Pin gauges, drill pattern reference artwork.
Drill entry / back up material type: Slitback Aluminium 0.010"(0.254mm) & LCOA 0.093"(2.36mm)

Number of boards in one stack (multilayers): Process specific, 1 to 3 high.

How many times are drill bits re-sharpened: As per customer or IPC specification.

How is each re-sharpening controlled: Color coded.

How many hits are made on multilayer boards: As per IPC, military or commercial requirements.

What kind of image method do you use (wet, dry film): Dry film. 0.002"(0.05mm)

Is image inspected before and after etching: YES, using first off.

Are inner layers electrically tested before lamination: YES, Automated Optical Inspection

Are inner layers optically inspected before lamination: YES, with two AOI machines

What brand of dry film do you use: Dupont Riston

What thickness of dry film is used on a panel plated board requiring tin/lead plate only: 0.002"(0.05mm)

Brand name of model and laminators: Dupont HRL2400/LC2400

Maximum panel size: 24"(610mm) width.

Do exposure units have built-in light integrators: YES

How do you ensure proper exposure and developing (Stouffer strip, gray scale, step wedge): Stouffer strip on every lot.

How is the developer controlled for maximum strength and quality: Feed and bleed, concentration, breakpoint monitoring.

Type of dry film used: Aqueous

How is the image located to the board: Registration Frames.

What is the thinnest line width and spacing which can be pattern plated and tin/lead plated on a consistent basis with your dry film process: 0.003"(0.10mm) traces, 0.003"(0.10mm) spaces.

Do you provide positive etchback of the glass and epoxy: Customer request.

If you do not provide positive etchback, what is your smear removal process (chromic, sulfuric, vapor blast, water blast, plasma etch): Permanganate and plasma.

Do you treat military boards requiring etchback differently: YES, with March plasma etchback.

Frequency:
Cleaning line: 2 x daily
How controlled: normality/pH

Catalyst: 2 x daily
How controlled: normality/colour comparison to standard

Electroless: 3 x daily
How controlled: cu/caustic/formaldehyde

Do you have an in-house chemical lab: YES

Do you pattern plate: YES

Thickness: 0.001"(0.025mm) Minimum

Do you panel plate: YES Thickness: 0.001"(0.025mm) Minimum

Number of tanks and capacity: 3 x 550 gallons reverse pulse plating, 4 x 550 gallons DC plate & Each tank is divided into 4. Independantly controlled & rectified cells.

Frequency of in-house chemical analysis: Weekly

Frequency of hull cell testing: Weekly

Frequency of elongation test: Monthly

Frequency of thermal stress test: Daily

Name of outside lab: Cambridge Testing & Pacific Testing Labs.

What is the thickness of copper plate: 0.001"(0.025mm) - 0.0028"(0.0457mm)

Is this line manual or automatic: Manual

Are coupons used for cross section analysis: YES

Where are coupons located on the panel: Outside edges, generally to customer's spec.

How often is each bath carbon treated: Every 6 months.

Number of tanks and capacity: 1 x 550 gallons (2080L)

Frequency of in-house chemical analysis: Weekly

Frequency of hull cell testing: Weekly

Is this line manual or automatic: Manual

Is there a program for carbon treatment: YES

Are panels cleaned before copper pattern plate: YES, by chemical cleaning line.

How are nickel plate chemicals controlled: By lab analysis.

Name of brand and chemicals of gold line: Engelhard E75
Knoop hardness range: 130-190 (E75)
Can you perform selective gold plating: YES, gold.

Name and model of etcher: I.S. Strip, Etch, Strip line.

How are chemicals controlled for etchant: Automatic controller with lab monitoring.

What procedure do you use to control etch rate on both sides of the board: Use standard foil test piece to compare etch rates.

Type of screening equipment: Two DP10 Automatic double-sided coaters. One conveyorized Argus spray coater.

Type of ink:
One-part epoxy: YES
Two-part epoxy: YES

Type of curing oven:
TACK: BASSI (conveyorized)
FINAL: CUGHER (conveyorized ) & Batch ovens.

Preferred solder masks: Taiyo PSR 4000 (liquid photoimageable) or Solder Mask specified.

After reflow and board scrub, describe the method used to test for cleanliness before applying solder mask: Solvent extract conductivity (Ohmegameter).

U.V. Cure of Solder Mask: Yes

Finishes:
Teledyne Halco horizontal for all commercial SMOBC requirements.
Immersion Gold
MacDermid Sterling Immersion Silver
OSP
Hard Gold
Immersion White Tin
Electroplated gold for wire bonding

What are your internal limits for a clean board: 6.45 micrograms NaCl equiv./sq. in.(6.45cm2)

If the process is solder mask over bare copper, describe the method used for etch resist and preparation prior to solder mask: Tin/lead plating, chemical clean and pumice scrub.

Do you have dry film capabilities: YES

Brand name of solder mask: Dupont Vacrel 8100 Series

What is the film thickness: 0.003"(0.10mm)

Are the same controls used here as with dry film image: YES

Is the test procedure for the cleanliness of the board surface the same here as with the LPI type solder mask: YES

Component designation marking:
Colors of ink available: White, yellow, black, red epoxy and white photo-imageable.

Brand name of electrical test equipment:

4	PROBOT double sided tester
1	MANIA universal single side SMT testers
1	CIRCUIT LINE universal DOUBLE sided SMT tester
2	ECT 16 head Flying Probe testers

Opens and shorts test: YES
Hi-pot test: YES (if specified)
Isolation: 100 megohms.
Current: Variable up to 20 & 100 milliamps.
Voltage: Variable up to 250 volts. (1000 volts on PROBOTS available)
Continuity: 5 ohms.

Type of routing equipment: Excellon, Pluritec, ATI.

Scoring Available: Yes, we have an Accu Score Labs AS-150-JE Jump Scoring 4 axis machine

Is your company ISO 9001 approved: YES, since 1992.

Statistical Process Control and Ship To Stock Programs:Please see the appendix for SPC charts in use. 'Design Of Experiments' is used by Process Engineering to resolve process problems.

Are SPC procedures in place presently, and if so, at which operations: See appendix.

Does the Quality Department have:
Written policy and procedures: YES
Quality Engineering department: YES
Incoming inspection department: YES
Written inspection instructions: YES
In-process inspection department: YES
Final inspection department: YES
Gauge control program: YES
Cross section lab: YES
Chemical analysis lab: YES
An area for a source inspector: YES

Is there traceability of processing dates, operators, etc: YES, operators and inspectors initial and date travelers which accompany each job.

How do you control traceability of raw materials: There is a computer file which tracks all job numbers which are issued against a given raw material lot number.

Do you have a procedure for customer returns: YES

Are inspection tools and in-process equipment calibrated in-house or outside: Both.

Are customers' artworks inspected at incoming: YES, Visual and DRC on CAMs for data.

How are drill hole sizes verified: Pin gauges.

List outside sources used for calibration of inspection tools and in-process equipment: Holtz Precision (Mississauga, ON), Quantum Labs (Burlington, ON), Tektronix (Mississauga, ON), Browne & Sharpe (Michigan), Instruments Canada (Toronto, ON).

Is rejected incoming material segregated and maintained in a separate area: YES

How is drill quality controlled and monitored: Inspection of drill bits, control of drill parameters (hits, speeds and feeds) by documented procedures, augmented by feedback from the micro-section department.

At the drilling operations, how are ¨x¨ and ¨y¨ hole locations verified: By comparison with approved drill template and validator.

Do you perform incoming inspection of laminate and prepreg: YES

Are drill bits inspected at incoming: YES

Controlled depth drilling available: YES

Is the temperature and humidity of the dry film image area controlled: YES, along with HEPA clean room filtration.

Comment on the methods used for preventing boards from warping: Cross-plying of laminate material. Artwork design and multilayer build are reviewed prior to production. Symmetrical constructions around the center of the board are used. Controlled cool-down after lamination.

What inspection process is used to verify that nailheading and epoxy smear are not present: Micro-sectioning, also visual inspection using 60x stereoscope. 200x scope is also available.

What inspection process do you use to ensure accurate inner layer alignment: Formal incoming inspection of artwork. Inner layers are also checked by AOI.

What other methods do you have available:
X-ray and micro-section for drilling.
Perfectest registration system.
Smart camera drill with our Schmoll Drill System.

At which operations do you check hole sizes with pin gauges: Drilling, copper-tin/lead plating, hot air leveling or tin/lead fusing, final inspection.

What inspection procedures are in place at nickel/gold plate: XRF for thickness, tape testing for adhesion.

Are corrective action meetings held on a regular basis and who attends: MRB meetings are held ad hoc and corrective actions are formally documented.

Are individual operators responsible for Quality in addition to Quality Control: YES