Dynamic & Proto Circuits, Inc. Dynamic & Proto Circuits Inc.
 
 
  High quality printed circuit boards.
Printed Circuit Boards
Due to our diversified manufacturing and engineering capabilities, we can offer the following;
  • Typical Quick Turn Around (Q.T.A) in 2 to 10 days
  • Tetrafunctional FR-4, Polyimide, BT-Epoxy and Teflon base materials
  • Mix Materials
  • Custom heat sink bonding
  • Metal core
  • Controlled impedance technology (including differential)
  • BGA, Micro-BGA
  • Buried and blind vias
  • 0.016" pitch S.M.T., and 0.003" lines and spacing in various surface finishes including tin, nickel, gold, silver, organic coating and horizontal hot air solder leveling
  • Complete in-house capabilities
  • An ISO 9001 and MIL-PRF-31032 Certified Quality System
In addition, we are proficient with a wide range of solder mask technologies including liquid photo-imageable and dry-film aqueous.

While components and craftsmanship establish a board's efficiency, a company's productivity level is determined by years of staff experience, our core competency as well as technology. That's why, DAPC is committed to maintaining & continuously training the best PCB people in the industry and utilizing the most advanced equipment and engineering processes available.

We understand that by giving people the right tools that maximum efficiency and quality is achieved. DAPC delivers average Quick-Turn-Around times of two to ten days, and standard production runs times of four to six weeks.

Also, to improve production accuracy and reduce variation, Statistical Process Control (SPC) techniques are utilized throughout our plant with all boards inspected at strategic points, then electronically tested before shipment. Design data is scrutinized before manufacturing begins, plus knowledgeable staff members work closely with clients to produce prototype boards for test run or low to medium volume production runs.

 
 
Capabilities
Printed Circuit Boards
Class3/Military
Quality
Lead-Free RoHS
Technical Seminars
DFM Analysis
NetList Comparison
Impedance Modeling
Failure Analysis
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