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Failure analysis.
Failure Analysis is the investigation into why a board may have failed post production. Although rare, it does happen. Failures could be due in part to a process problem in the manufacturing of the PCB or at the assembly phase of the board. Some of the most common causes of PCB failures are listed below.
- PTH Via Opens
This could be caused by poor drilled hole quality, nail-heading, and thin electroplated copper.
- Inner Layer Separation
Failed inner layer connection to a PTH solder joint is related to poor inner layer strength caused by lack of etchback treatment during PCB fabrication.
- Exposed IMC on HASL PWBs
Poor quality HASL finishes on PWBs can cause severe solderability problems during reflow soldering operations. Exposed copper-tin IMC oxidizes and becomes very difficult to wet during reflow.
- Component Solderability
Excessive organics in the tin-lead coating on the QFP leads can lead to solderability issues.
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